QFN32-0.5 Burning Seat Chip Test Seat Flip Shrapnel Double-Layer Board Programming Seat, QFN32-0.5 11-15 inch and then turn on the

QFN32-0.5 Burning Seat Chip Test Seat Flip Shrapnel Double-Layer Board Programming Seat, QFN32-0.5 11-15 inch and then turn on the1. Working frequency: high frequency 2. Application range: integrated circuit IC 3. Production process: injection molding 4. Contact material: beryllium copper shrapnel 5. Insulator material: PPS PET 6. Number of cores: 32 7. Name: QFN32 flip shrapnel to 152 test seat 8. Purpose: programming socket and test socket, to program and test QFN32 IC chips 9. Chip size: 5x5cm 10. Pin spacing: 0. 5mm Specification: Package Weight One Package Weight 0. 06kgs

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